ASTM B734 PDF

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Advanced Plating Technologies offers both traditional alkaline cyanide copper plating services as well as non-cyanide alkaline copper plating and high-speed acid copper plating services for a wide range of engineering applications. Our company has precision barrel, rack and vibratory copper plating services which are currently employed in numerous industries including the ammunition, HVAC, power distribution, heat treatment, electronic, telecommunication and fastener industries. Advanced Plating Technologies copper plating service company can be utilized as a final plate or as an underplate to subsequent deposits.

APT also provides an unmatched capability in heavy build copper plating services with our company plating thicknesses up to 0. Applications of heavy build copper plating services include the eddy current drives, lead, tungsten and frangible core bullets reference Copper Bullet Plating in our Solutions in Surface Finishing section , braze fittings, coinage and heat treatment applications for a stop-off prior to carburizing or nitriding.

Advanced Plating Technologies can offer your company a proprietary tarnish inhibit in copper plating services to maintain a clean copper deposit. This system can also be applied to raw copper components as well to enhance the appearance and functionality of copper deposits.

An inhibited copper substrate or deposit will pass hour high humidity testing, maximizing the shelf life and storage of products finished with our copper plating services.

In addition, sealed nitrogen packaging can be provided for extended storage of copper deposits without the threat of surface oxidation or discoloration. Copper is a soft, ductile, lustrous metal with a pink hue that exhibits very high thermal and electrical conductivity. Pure copper is very soft and malleable but can have considerable strength when alloyed with elements such as beryllium, chromium or tellurium.

Most commonly copper is alloyed with zinc to form brass or with tin to form bronze alloys. Copper readily forms compounds with elements found in the atmosphere including oxygen, carbon and sulfur. Based upon the oxidation state, available moisture and pH of the environment, the compounds formed can have distinctive blue or green hues acidic environments as opposed to dark brown appearance alkaline environments. An evident example of this phenomenon is the green copper patina hydrated copper sulfate and carbonate visible on the Statue of Liberty due to the acidic rain of New York City.

Copper is one of the few metals to occur naturally as an uncompounded mineral. It is theorized that only gold and meteoritic iron have been utilized by civilizations longer than copper. For plating applications, copper is commonly used as an underplating to enhance adhesion of deposits, improve electrical properties, impair migration of alloying elements into the final plated deposit, or to improve corrosion resistance of the overall deposit. As a final deposit, copper plating services are used for enhancing the brazing, thermal or electrical conductivity of substrate materials, as a high temperature lubricant, as a heat treatment stop-off, or for jacketing of projectiles.

Copper can be plated matte to bright and with a wide range of deposit hardness and ductility. APT also can certify our copper plating services to AMS as well as most company-specific copper plating specifications. Type of Copper Plating bath is not specified. Classes of copper plating services as follows:. Class 0 — 0. Class 0 — for heat treatment stop-off shield Class 1 — for carburizing shield, decarburizing shield and printed circuit board plated through holes or as specified on the engineering drawing.

Class 2 — for undercoating for nickel and other metals Class 3 — to prevent basis metal migration into tin layer to poison solderability Class 4 — 0. Class 25 — 25um minimum coating thickness Class 20 — 20um minimum coating thickness Class 12 — 12um minimum coating thickness Class 5 — 5um minimum coating thickness Class x — Thickness as specified [um].

Type 1 Engineering Plating Shall designate a thickness of 0. Copper Plating Services — Copper Plating Properties Copper is a soft, ductile, lustrous metal with a pink hue that exhibits very high thermal and electrical conductivity.

Classes of copper plating services as follows: Class 0 — 0. Classes of copper plating services as follows: Class 25 — 25um minimum coating thickness Class 20 — 20um minimum coating thickness Class 12 — 12um minimum coating thickness Class 5 — 5um minimum coating thickness Class x — Thickness as specified [um] Copper Plating Services to AMS Type 1 Engineering Plating Shall designate a thickness of 0.

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ASTM B-734

Historical Version s - view previous versions of standard. More B This specification establishes the requirements for electrodeposited copper coatings used for engineering purposes including surface hardening, heat treatment stop-off, as an underplate for other engineering coatings, for electromagnetic interference shielding in electronic circuitry, and in certain joining operations. This specification does not cover electrodeposited copper used as a decorative finish, as an undercoat for other decorative finishes, or for electroforming.

DN 118 COPAM PDF

Standard Specification for Electrodeposited Copper for Engineering Uses

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